Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes
Yoshio Kobayashi
Yusuke Yasuda
Toshiaki Morita
This review introduces our study on the development of Cu-based nanoparticles suitable as fillers in the metal-metal bonding process. Colloid solutions of various nanoparticles such as cuprous iodide, cupric oxide (CuO), CuO mixed with silver oxide (Ag2O/CuO), cuprous-oxide (Cu2O), metallic Cu, plolypyrrole-coated metallic Cu, and metallic Cu containing metallic Ag (Ag/Cu) were prepared by liquid phase processes such as reduction and a salt-base reaction. Metal-metal bonding properties of their powders were evaluated by sandwiching the particle powder between metallic discs, annealing them at a pressure of 1.2 MPa, and measuring the shear strength required for separating the bonded discs. Various particles (above-mentioned), various metallic discs (Cu, Ag, and Ni), various bonding temperatures (250-400 C), and different atmospheres in bonding (H2 and N2) were examined to find nanoparticle filler suitable for metal-metal bonding. As a result, it was confirmed that the metallic Cu, the CuO, the Ag2O/CuO, and the Ag/Cu particles were suitable for Cu-Cu bonding in H2, low-temperature Cu-Cu bonding in H2, Ag-Ag bonding in H2, and Cu-Cu bonding in N2, respectively. The metallic Cu particles also had functions of Ag-Ag and Ni-Ni bondings in H2. These results were explained with the particle size, the amount of impurity, and the d-value.
Chi tiết xin mời tham khảo tại http://repository.vnu.edu.vn/handle/VNU_123/58285
Yusuke Yasuda
Toshiaki Morita
This review introduces our study on the development of Cu-based nanoparticles suitable as fillers in the metal-metal bonding process. Colloid solutions of various nanoparticles such as cuprous iodide, cupric oxide (CuO), CuO mixed with silver oxide (Ag2O/CuO), cuprous-oxide (Cu2O), metallic Cu, plolypyrrole-coated metallic Cu, and metallic Cu containing metallic Ag (Ag/Cu) were prepared by liquid phase processes such as reduction and a salt-base reaction. Metal-metal bonding properties of their powders were evaluated by sandwiching the particle powder between metallic discs, annealing them at a pressure of 1.2 MPa, and measuring the shear strength required for separating the bonded discs. Various particles (above-mentioned), various metallic discs (Cu, Ag, and Ni), various bonding temperatures (250-400 C), and different atmospheres in bonding (H2 and N2) were examined to find nanoparticle filler suitable for metal-metal bonding. As a result, it was confirmed that the metallic Cu, the CuO, the Ag2O/CuO, and the Ag/Cu particles were suitable for Cu-Cu bonding in H2, low-temperature Cu-Cu bonding in H2, Ag-Ag bonding in H2, and Cu-Cu bonding in N2, respectively. The metallic Cu particles also had functions of Ag-Ag and Ni-Ni bondings in H2. These results were explained with the particle size, the amount of impurity, and the d-value.
Chi tiết xin mời tham khảo tại http://repository.vnu.edu.vn/handle/VNU_123/58285
| Title: | Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes |
| Authors: | Yoshio Kobayashi Yusuke Yasuda Toshiaki Morita |
| Keywords: | Cupper;Nanoparticle;Colloid;Filler;Metalemetal bonding |
| Issue Date: | 2016 |
| Publisher: | ĐHQGHN |
| Description: | p. 413-430 |
| URI: | http://repository.vnu.edu.vn/handle/VNU_123/58285 |
| ISSN: | 2468-2284 |
| Appears in Collections: | Advanced Materials and Devices |
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